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XCVM1502-1MSINFVB1369

Part number XCVM1502-1MSINFVB1369
Product classification System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC VERSALPRIME ACAP FPGA 1369BGA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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$8,384.2500

$8,384.2500

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TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ Prime
PackageTray
Product StatusACTIVE
Package / Case1369-BFBGA, FCBGA
Speed600MHz, 1.3GHz
RAM Size256KB
Number of I/O478
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-FCBGA (35x35)
ArchitectureMPU, FPGA

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RES SMD 1.1K OHM 5% 1/8W 0805
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RES SMD 2.4K OHM 5% 1/8W 0805
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RES SMD 3K OHM 5% 1/8W 0805
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RES 68 OHM 5% 3W AXIAL
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RES 47K OHM 5% 1W AXIAL
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DIODE GEN PURP 800V 12A DO203AA
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