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AGFD023R31C3E3E

Part number AGFD023R31C3E3E
Product classification System On Chip (SoC)
Manufacturer Intel
Description IC FPGA AGILEX-F 3184FBGA
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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$18,509.4420

$55,528.3260

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Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case3184-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package3184-BGA (56x45)
ArchitectureMPU, FPGA
Alternative models
AGFD023R31C3E3E
英特尔-Intel
英特尔® Agilex™ 7 F 系列 023 FPGA
Similar models
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英特尔® Agilex™ 7 F 系列 023 FPGA
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英特尔® Agilex™ 7 F 系列 023 FPGA

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
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RES SMD 2.4K OHM 5% 1/8W 0805
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RES SMD 1.5K OHM 5% 1/8W 0805
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RES SMD 3K OHM 5% 1/8W 0805
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RES 68 OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 560 OHM 5% 3W AXIAL
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RES 5.1K OHM 5% 3W AXIAL
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RES 43K OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 47K OHM 5% 1W AXIAL
Vishay General Semiconductor – Diodes Division
DIODE GEN PURP 800V 12A DO203AA
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